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TIC 4000

Features and Benefits:
• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance: 0.19C/W @ 50 psi

TIC 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based  heat sink.  Other high watt density  applications will benefit from the extremely low thermal impedance of
TIC 4000.

TIC 4000 compound wets out the thermal interface surfaces and flows to produce low thermal impedance. The compound requires pressure of the assembly to cause flow. TIC 4000 compound will not drip.

For a typical 0.5" x 0.5" application at 0.005" thick, Bergquist estimates approximately 0.02 ml (cc) of TIC 4000.

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