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Sil-Pad 900S

Features and Benefits:
• Thermal impedance: 0.61ºC-in2/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution

The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.

Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of minimizes interfacial thermal resistance and maximizes thermal performance.

Typical Applications Include:
• Power supplies
• Automotive electronics
•Motor controls
•Power semiconductors

  • Sil Pad 900S

    Sil Pad 900S

    Cod produs: sil pad 900S

    Categoria: Sil-Pad 900S

    Producator: BERGQUIST GmbH

     Sil Pad 900S

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