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Q-Pad 3

Features and Benefits:
• Thermal impedance: 0.35°C-in2/W (@50 psi)
• Eliminates processing constraints typically associated with grease
• Conforms to surface textures
• Easy handling 
• May be installed prior to soldering and cleaning without worry

Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks.

Fiberglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.


Typical Applications Include:
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors, transformers and solid state relays

  • Q-Pad 3

    Q-Pad 3

    Cod produs: Q-Pad 3

    Categoria: Q-Pad 3

    Producator: BERGQUIST GmbH

     Q-Pad 3

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