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Liqui-Form™ 2000

Liqui-Form™ 2000

Thermally Conductive, One-Part, Liquid Formable Material

Features and Benefits:

• Thermal Conductivity: 2.0 W/m-K
• Applies very low force on components during assembly
• Low volumetric expansion
• Excellent chemical and mechanical stability even at higher temperatures
• No curing required
• Stable viscosity in storage and in the application

Liqui-Form™ 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework.

Liqui-Form™ 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. Liqui-Form™ 2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application.

Typical Applications Include:
• Bare die to heat spreader lid
• Filling various gaps between heat-generating devices to heat sinks and housings
• Devices requiring low assembly pressure
• BGA, PGA, PPGA

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