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Hi-Flow 565U

Features and Benefits
• Thermal impedance: 0.04°C-in2/W (@25 psi)
• Very high thermal conductivity: 3.5 W/mK
• 52°C phase change temperature
• Unsupported

Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C. After phase change, Hi-Flow 565U wets out the thermal interfaces resulting in a very low thermal impedance.

Hi-Flow 565U displaces easily at low pressures to provide a thermal performance comparable to the best thermal greases.
Hi-Flow 565U is provided at a consistent thickness to ensure reliable performance. Hi-Flow 565U is attached to the target surface via pressure from a hard rubber roller or squeegee.

Typical Applications Include
• Processor lid to heat sink
• Processor die to lid or heat sink 
• FBDIMM to heat spreader

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