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Hi-Flow 300P

Features and Benefits:
• Thermal impedance: 0.13°C-in2/W (@25 psi)
• Field-proven polyimide film
     - excellent dielectric performance
     - excellent cut-through resistance
• Outstanding thermal performance in an insulated pad

 Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle, and the 55°C phase change temperature minimizes shipping and handling problems.

Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on a easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.

Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.

Typical Applications Include:
• Spring / clip mounted
• Discrete power semiconductors and modules

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