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Gap Pad VO Ultra Soft-B

Features and Benefits:
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• Gel-like modulus 
• Decreased strain
• Puncture, shear and tear resistant
• Electrically isolating

Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.
 Gap Pad VO Ultra Soft-B is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:
• Various IC Packages
• Thermally enhanced BGA packages
• Between any heat-generating semiconductor and a heat sink
• Computers and peripherals
• Telecommunications
• Power conversion
• Automotive
• LED lighting packages

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