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Gap Pad VO Soft

Features and Benefits:
• Thermal conductivity: 0.8 W/m-K
• Conformable, low hardness
• Enhanced puncture, shear and tear resistance
• Electrically isolating

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components.
Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

  • Gap Pad VO Soft

    Gap Pad VO Soft

    Cod produs: Gap Pad VO Soft

    Categoria: Gap Pad VO Soft

    Producator: BERGQUIST GmbH

     Gap Pad VO Soft

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