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Gap Pad HC 1000

Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-Like” modulus
• Fiberglass reinforced for puncture, shear and tear resistance

Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad HC1000 is offered with removable protective liners on both sides of the material.

Note: Resultant thickness is defined as the final gap thickness of the application

Applications Include:
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
• Area where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules

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