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Gap Pad 2200SF

Features and Benefits
• Thermal conductivity: 2.0 W/m-K
• Silicone-free formulation
• Medium compliance with easy handling
• Electrically isolating

Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad 2200SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides.
Gap Pad 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework.

Typical Applications:
• Digital disk drives
• Proximity near electrical contacts (e.g. DC brush motors, connectors, relays)
• Fiber optics modules

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