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Gap Pad 2000S40

Features and Benefits:
• Thermal conductivity: 2.0 W/mK
• Low "S-Class" thermal resistance at very low pressures
• Highly conformable, low hardness
• Designed for low stress applications
• Fiberglass reinforced for puncture, shear and tear resistance

Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

Gap Pad 2000S40 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:
• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls

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