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Gap Pad 1500R

Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction 
• Electrically isolating

Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Area where heat needs to be transferred to a frame chassis, or other type of heat spreader

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