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Gap Pad 1500

Features and Benefits:
• Thermal conductivity: 1.5 W/m-K
• Un-reinforced construction for additional compliancy
• Conformable, low hardness
• Electrically isolating

Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

 Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis, or other type of heat spreader

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