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Bond-Ply LMS 500P

Features and Benefits:
• Polyimide film provides high dielectric strength
• Intended for secondary and primary voltage power applications
• Reliable lap shear strength at temperature extremes
• Quick cure rate
• Excellent CTE and shock/vibe absorption

Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a polyimide film, and double lined with protective films.The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch and shock and vibration while providing exceptional thermal performance and long-term adhesion and dielectric integrity.
Bond-Ply LMS 500P is typically used for bonding power components and PCBs to a heatsink. See application note for lamination recommendations.

Typical Applications Include:
• Discrete semi-conductor packages bonded to heat spreader or heat sink

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