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Bond-Ply 400

Features and Benefits
• Thermal impedance: 0.87°C-in2/W (@50 psi)
• Easy Application
• Eliminates need for external hardware (screws, clips, etc.)
• Available with easy release tabs

Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of “low energy” surfaces, including many plastics, while maintaining high bond strength with long term exposure to heat and high humidity.

Typical Applications Include

Secure:
• Heat sink onto BGA graphic processor
• Heat sink to computer processor 
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB

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