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Bond-Ply 100

Features and Benefits:
• Thermal impedance 0.52°C-in2/W (@50 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting.

Typical Applications Include:
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB

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