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Bergquist Liquid Formable Materials

Liqui-Form is a high thermal conductivity liquid formable TIM.
It is designed for demanding applications requiring a balance during
assembly between dispensability, low component stress and ease of rework.
The unique thixotropic formulation is highly conformable and has a natural
tack ensuring it forms around the components and stays in place in the
application. The first of a new Liqui-Form product line, it requires no curing,
mixing or refrigeration. With low assembly pressure it is ideal for bare
die to heat spreader, BGA, PGA and PPGA applications.

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